Lost wafer process
0604001-93
[DEFINITION]
A technique that uses selective etching to remove most of a
substrate
and leaving part of the diffusion layer.
[DESCRIPTION]
Normally, electrical circuits on a substrate have a fabrication
depth of several micrometers from the surface. In the lost wafer process, the electrical circuit
section is left intact while eliminating the area below it by etching or other means, then the
circuit section is bonded to a glass substrate or similar to fabricate a sensor, etc. Multiple
microelectrodes, visual imagers, and multiprobe scanning tunneling microscopes (STMs) are
experimentally fabricated.
[References]
(1)(3)
[Related Terms]