through-silicon via, TSV

perpendicularly penetrating electro interconnection between both surfaces of a silicon substrate.(IEC/2015)


Through-silicon-vias are mainly applied to three-dimensionally stacked packaging of semiconductor devices. In the MEMS fields, the through-silicon-vias are applied to wafer level packaging technology. Some through-silicon-vias consist of through-via, insulator and electrode material. Solder, copper, doped-poly-silicon and so on are used as electrode materials..


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