Reactive Ion Etching(RIE)


A technique that combines etching with corrosive gas and sputtering with ions.

Under reactive ion etching, the material is removed selectively in the vertical direction under the mask by both chemical reaction and physical bombardment (sputtering) with ions and radicals produced in plasma. Distinguished from anisotropic etching wherein the direction of erosion depends on the crystal orientation of the material, in RIE the direction of removal is determined by the direction of ion stream. RIE results less undercuts erosion from the edge beneath the mask than wet etching.


[Related Terms]
Aspect ratio