A process of mounting components into a container that has external
terminals for protecting the components.
The purpose of packaging is to minimize the external chemical and
physical damage to the components. As the device is miniaturized, strain due to the packaging
stress is possibly being troublesome. To prevent this, for example, the bonding technology that
joins micro-components and so on to a silicon chip is important. In the field of sensor system, the
hybrid integration technology is necessary so that special packaging technique is being studied.