A process of mounting components into a container that has external terminals for protecting the components.

The purpose of packaging is to minimize the external chemical and physical damage to the components. As the device is miniaturized, strain due to the packaging stress is possibly being troublesome. To prevent this, for example, the bonding technology that joins micro-components and so on to a silicon chip is important. In the field of sensor system, the hybrid integration technology is necessary so that special packaging technique is being studied.


[Related Terms]
Micromachining (1)