Lost wafer process


A technique that uses selective etching to remove most of a substrate and leaving part of the diffusion layer.

Normally, electrical circuits on a substrate have a fabrication depth of several micrometers from the surface. In the lost wafer process, the electrical circuit section is left intact while eliminating the area below it by etching or other means, then the circuit section is bonded to a glass substrate or similar to fabricate a sensor, etc. Multiple microelectrodes, visual imagers, and multiprobe scanning tunneling microscopes (STMs) are experimentally fabricated.


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