Ion plating


A vapor deposition in which the vaporized particles are ionized or energized in plasma and deposited on the substrate by applying kinetic energy through an electrical field.

This is a composite technology combining vacuum deposition and plasma technology. Whereas in the conventional vacuum deposition process, most of the particles that reach the substrate are neutral, in this method, the particles are ions, excited particles, and radicals with internal energy and kinetic energy. Therefore, compared with vacuum deposition, the structure and properties of the plated film are much more elaborate. Because the deposition rate is also high and the properties of the film are good, this method is used extensively instead of electroplating, especially in the production of a layer on nonconductive materials.


[Related Terms]
Vapor deposition