Focused ion beam machining, FIB-machining0604102-177
A technique that removes microscopic portion of material from the
surface by means of sputtering with accelerated and focused ions.
The use of a focused ion beam of a diameter of about 0,1 μm makes it possible
to bore microscopic holes at high accuracy, to sharpen various types of
probe, and to process and modify aspheric surface lenses. By measuring
the changes in intensity of secondary ions or secondary electrons ejected
from the material, the depth of processing can also be controlled accurately.
One drawback is the slow process speed, and another drawback is that relatively
complex equipment is necessary to obtain the required high vacuum.