Chemical vapor deposition (CVD)0605202-28
A type of vapor deposition that uses chemical reaction.
Chemical vapor deposition is a technique that places heated solid
in a vapor ambient of volatile substances (such as halides and organic compounds) to deposit a
substance from the vapor onto a solid surface by means of a high temperature heterogeneous reaction
(decomposition, reduction, or replacement). CVD is indispensable in silicon process tech-nology.
Some trial and error may be necessary to determine the process conditions such as the vapor
concentration, pressure, and temperature because there is no established method to control the
deposition thickness. The single crystal thin film is produced usually by the epitaxial growth
method, which grows the crystal aligned with crystallographics axis of the substrate.